Patent · US Active

Fabricating large area multi-tier nanostructures

US9972699B1 · kind B1 · utility

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12Claims
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Key dates

Filing dateFeb 26, 2018
Grant dateMay 15, 2018
Priority date
Expiry dateFeb 26, 2038

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D30/0212
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Methods for fabricating and replicating self-aligned multi-tier nanoscale structures for a variety of cross-sectional geometries. These methods can utilize a single lithography step whereby the need for alignment and overlay in the process is completely eliminated thereby enabling near-zero overlay error. Furthermore, techniques are developed to use these methods to fabricate self-aligned nanoscale multi-level/multi-height patterns with various shapes for master templates, replica templates and nanoimprint based pattern replication. Furthermore, the templates can be used to pattern multiple levels in a sacrificial polymer resist and achieve pattern transfer of the levels into a variety of substrates to form completed large area nanoelectronic and nanophotonic devices using only one patterning step.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.