Optoelectronic semiconductor device having contact track with relieved thermo-mechanical stress

US9972759B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Walter Wegleiter · Nittendorf, DE
• Paola Altieri-Weimar · Regensburg, DE
• Juergen Moosburger · Lappersdorf, DE
• Stefan Stegmeier · Munich, DE
• Karl Weidner · Birkenfeld, DE

Key dates

• Filing date: Jan 23, 2014
• Grant date: May 15, 2018
• Expiry date: Feb 10, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1815
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to a device (1), comprising at least one optoelectronic semiconductor component (2) and a substrate (5), on which the semiconductor component is arranged, wherein an insulating layer (4) is adjacent to a lateral surface (25) that bounds the semiconductor component; a contact track (6) is arranged on a radiation passage surface of the semiconductor component and is connected to an electrically conductive manner to the semiconductor component; the contact track extends beyond the lateral surface of the semiconductor component and is arranged on the insulating layer; and the contact track is relieved with respect to a thermomechanical load occurring perpendicularly to the lateral surface.