Die supply apparatus
US9974216B2 · kind B2 · utility
0Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2013 |
| Grant date | May 15, 2018 |
| Priority date | — |
| Expiry date | Jan 31, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/7565
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A supply head of a die supply apparatus is detachably held by a head holding unit of a head moving mechanism. The supply head held by the head holding unit is replaceable with a supply head having the same number of nozzles as the number of nozzles of a mounting head of a component mounting machine. A nozzle arrangement of the supply head of the die supply apparatus has the same arrangement as a nozzle arrangement of the mounting head of the component mounting machine.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.