Composition of solid-containing paste
US9975206B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 4, 2012 |
| Grant date | May 22, 2018 |
| Priority date | — |
| Expiry date | Apr 24, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/362
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Solder paste compositions and methods for applying solder paste. The solder paste includes lubricating additives to the flux to decrease friction and the changes of metal to metal contact between the surfaces of the solder balls and other surfaces that the solder balls come into contact with. The solder paste also includes solder balls of different average sizes, that improves the desirable liquid like properties of the granular paste while further reducing viscosity. As such, the solder paste is used in current screen printing solder paste application methods without the risk of clogging or agglomeration of solder paste particles on surfaces. The solder paste is also used in jetting or dispensing solder paste application methods without the risk of clogging or agglomeration within the cylinders/containers or apertures and nozzles that are used within such methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.