System and method for selective zapping
US9978627B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2016 |
| Grant date | May 22, 2018 |
| Priority date | — |
| Expiry date | Oct 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05F3/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for zapping a wafer, the system includes a pulse generator; a sensor; a first conductive interface; a second conductive interface; a controller; wherein the pulse generator is configured to generate zapping pulses; wherein the first conductive interface is configured to provide the zapping pulses to a first location of a backside insulating layer of a wafer; wherein the sensor is configured to monitor a coupling between the first conductive interface and the second conductive interface to provide a monitoring result; wherein the monitoring occurs while the second conductive interface contacts a second location of the backside insulating layer; and wherein the controller is configured to control a generation of the zapping pulses in response to the monitoring result.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.