Method of making a printed circuit board copper plane repair
US9980382B2 · kind B2 · utility
0Cited by
12References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2015 |
| Grant date | May 22, 2018 |
| Priority date | — |
| Expiry date | May 2, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1056
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device has a base with a mounting surface with a length and a stack, the stack having a diameter smaller than the length and fastened to the mounting surface. The stack may have a plurality of stack conductive layers in addition to a plurality of insulating layers that separate each of the plurality of stack conductive layers. The stack conductive layers may be separated in a manner that aligns them with corresponding printed circuit board conductive layers when the stack portion of the device is inserted into an aperture in a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.