Discrete electronic device embedded in chip module

US9980385B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Andreas Huber · Holzgerlingen, DE
• Harald Huels · Eppelheim, DE
• Stefano S. Oggioni · Cantù, IT
• Thomas Strach · Wildberg, DE
• Thomas-Michael Winkel · Eppelheim, DE

Key dates

• Filing date: Apr 24, 2017
• Grant date: May 22, 2018
• Expiry date: Apr 24, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/10106
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.