Method for processing a carrier

US9984930B2 · kind B2 · utility

Assignee

• Infineon Technologies Dresden GmbH & Co. KG · DE

Inventors

• Stefan Tegen · Dresden, DE
• Marko Lemke · Dresden, DE

Key dates

• Filing date: Jun 28, 2016
• Grant date: May 29, 2018
• Expiry date: Jun 28, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D86/011
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for processing a carrier may include: forming a plurality of structure elements at least one of over and in a carrier, wherein at least two adjacent structure elements of the plurality of structure elements have a first distance between each other; depositing a first layer over the plurality of structure elements having a thickness which equals the first distance between the at least two adjacent structure elements; forming at least one additional layer over the first layer, wherein the at least one additional layer covers an exposed surface of the first layer; removing a portion of the at least one additional layer to expose the first layer partially; and partially removing the first layer, wherein at least one sidewall of the at least two adjacent structure elements is partially exposed.