High voltage power electronics module for subsea applications under high hydrostatic pressure and temperature variations
US9984948B2 · kind B2 · utility
0Cited by
6References
17Claims
0Family size
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Key dates
| Filing date | May 4, 2017 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | May 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power electronics module includes: a baseplate, a power semiconductor chip arranged on the baseplate, and an encapsulation structure arranged on the baseplate and configured to encapsulate the power semiconductor chip, wherein the encapsulation structure is an epoxy having an elastic modulus in a range of 1 to 20 Giga Pascal, GPa, at room temperature and a coefficient of thermal expansion less than 20 ppm/K.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.