David Guillon
7Patents
1h-index
16Co-inventors
40Inventor score
Filing activity: Jul 2, 2015 → Mar 28, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9949385B2 | Semiconductor module with ultrasonically welded terminals | Electricity | 2 | Active |
| US12094791B2 | Power semiconductor device with free-floating packaging concept | Electricity | 0 | Active |
| US9975194B2 | Method for ultrasonic welding with particles trapping | Performing Operations; Transporting | 0 | Active |
| US9984948B2 | High voltage power electronics module for subsea applications under high hydrostatic pressure and temperature variations | Electricity | 0 | Active |
| US10854524B2 | Power semiconductor module | Electricity | 0 | Active |
| US12218192B2 | Metal substrate structure for a semiconductor power module | Electricity | 0 | Active |
| US11362008B2 | Power semiconductor module embedded in a mold compounded with an opening | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.