System, apparatus, and method for embedding a device in a faceup workpiece
US9985010B2 · kind B2 · utility
3Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2015 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | Oct 23, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated package may be manufactured in a die face up orientation with a component proximate to the attached die by creating a cavity in the mold compound during fabrication. The cavity is created with an adhesive layer on the bottom to hold a component such that the top surface of the component is co-planar with the top surface of the attached die. This may allow backside grinding to take place that will not damage the component because the top surface alignment between the attached die and the component prevents the depth of the cavity from extending into the portion of the package that is ground away.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.