Multi-layered film and method of manufacturing the same
US9985196B2 · kind B2 · utility
0Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2015 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | Jun 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/877
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A multi-layered film includes an electroconductive layer made of platinum (Pt), a seed layer including lanthanum (La), nickel (Ni), and oxygen (O), and a dielectric layer being preferentially oriented in a c-axis direction, which are at least sequentially disposed on a main surface of a substrate made of silicon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.