Vertical magnetic barrier for integrated electronic module and related methods
US9986639B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2015 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | Oct 12, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1006
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated electronic component assembly can include an electrically-conductive structure comprising two or more electrically-conductive terminals accessible on an exterior of the integrated electronic component assembly, a first component attachment region for a first component within the integrated electronic component assembly, and a second component attachment region for a second component within the integrated electronic component assembly. The integrated electronic component assembly can include an electrically-conductive magnetically-permeable shield coupled to or defined by the electrically-conductive structure, the electrically-conductive magnetically-permeable shield located between the first and second component attachment regions, including a portion extending in a direction out of a plane defined by the first and second component attachment regions, to suppress magnetic coupling between the first and second components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.