Versatile process for precision nanoscale manufacturing
US9987653B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 14, 2016 |
| Grant date | Jun 5, 2018 |
| Priority date | — |
| Expiry date | Oct 14, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/0038
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for depositing thin films using a nominally curved substrate. Drops of a pre-cursor liquid organic material are dispensed at a plurality of locations on a nominally curved substrate by one or more inkjets. A superstrate is brought down on the dispensed drops to close the gap between the superstrate and the substrate thereby allowing the drops to form a contiguous film captured between the substrate and the superstrate. A non-equilibrium transient state of the superstrate, the contiguous film and the substrate is enabled to occur after a duration of time. The contiguous film is then cured to solidify it into a solid. The solid is separated from the superstrate thereby leaving a polymer film on the substrate. In this manner, such a technique for film deposition has the film thickness range, resolution and variation required to be applicable for a broad spectrum of applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.