Procedure of processing a workpiece and an apparatus designed for the procedure
US9991150B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 28, 2016 |
| Grant date | Jun 5, 2018 |
| Priority date | — |
| Expiry date | Nov 3, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1967
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a procedure of processing a workpiece such as backside grinding of a device wafer and an apparatus designed for the procedure. The procedure comprises (1) preparing a bonded stack comprising (e.g. consisting of) a carrier layer, a workpiece layer, and an interposer layer therebetween; (2) processing the workpiece layer; and (3) delivering a gas jet at the junction between two adjacent layers in the stack to separate or debond the two adjacent layers. Technical merits of the invention include enhanced efficiency, higher wafer throughput, reduced stress on workpiece surface, and uniformly distributed stress and avoidance of device wafer breakage and internal device damage, among others.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.