Rigid-bend printed circuit board fabrication
US9992880B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2016 |
| Grant date | Jun 5, 2018 |
| Priority date | — |
| Expiry date | Jan 13, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (PCB) has multiple layers, where select portions of one or more conductive layers, referred to as core circuitry, form a semi-flexible PCB portion that is protected by an exposed prepreg layer. The semi-flexible PCB portion having an exposed prepreg layer is formed using a dummy core process that leaves the exposed prepreg layer smooth and undamaged. The core circuitry is part of a core structure. The semi-flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The core structure is common to both the semi-flexible PCB portion and the remaining rigid PCB portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.