Slurry composition for polishing tungsten
US9994735B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Jun 22, 2016 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Jun 22, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23F1/10
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A slurry composition for polishing tungsten is provided. The slurry composition for polishing tungsten may include a water-soluble polymer, abrasive particles and an etching adjuster.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.