System and method to monitor semiconductor workpiece temperature using thermal imaging
US9995631B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2016 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Feb 8, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J2005/065
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved system for measuring the temperature of a plurality of workpieces in a rotating semiconductor processing device is disclosed. Because silicon has variable emissivity in the infrared band, a temperature stable, high emissivity coating is applied to a portion of the workpiece, allowing the temperature of the workpiece to be measured by observing the temperature of the coating. Further, by limiting the amount of coating applied to the workpiece, the effect of the coating on the intrinsic temperature of the workpiece and the surrounding semiconductor processing device may be minimized. The temperature of the workpieces is measured as the workpieces pass under an aperture by capturing a thermal image of a portion of the workpiece. In certain embodiments, a controller is used to process the plurality of thermal images into a single thermal image showing all of the workpieces disposed within the semiconductor processing device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.