Method and device for producing a lens wafer
US9995855B2 · kind B2 · utility
0Cited by
2References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 11, 2012 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Jun 21, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/024
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A device for producing a lens wafer with a plurality of microlenses with an upper die and a lower die for embossing of the lens wafer from a fluid embossing mass which has been delivered between the dies, curing means for curing of the embossed lens wafer, characterized in that at least one release element for detachment of the cured lens wafer prior to curing can be located between the lower die and the upper die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.