Via structures for thermal dissipation
US9997428B2 · kind B2 · utility
1Cited by
16References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2015 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Jul 14, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09509
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus, a semiconductor package including the apparatus and a method are disclosed. The apparatus includes a substrate, pluralities of vias disposed in the substrate. The vias are disposed in a hexagonal arrangement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.