Patent · US Active

Semiconductor packages and methods of forming the same

US9997467B2 · kind B2 · utility

4Cited by

0References

20Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Tung-Liang Shao · Hsinchu, TW
Chih-Hang Tung · Hsinchu, TW
Chen-Hua Yu · Hsinchu, TW

Key dates

Filing date	Jan 17, 2017
Grant date	Jun 12, 2018
Priority date	—
Expiry date	Jan 17, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Semiconductor packages and methods of forming the same are disclosed. Embodiments include forming a first recess in a first substrate, wherein a first area of an opening of the first recess is larger than a second area of a bottom of the first recess. The embodiments also include forming a first device, wherein a third area of a top end of the first device is larger than a fourth area of a bottom end of the first device. The embodiments also include placing the first device into the first recess, wherein the bottom end of the first device faces the bottom of the first recess, and bonding a sidewall of the first device to a sidewall of the first recess.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.