Electrode structure of light emitting diode
US9997672B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2016 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Oct 5, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/825
Abstract
An electrode structure of an LED includes an adhesion layer and a bond pad layer. The adhesion layer is stacked on the LED. The bond pad layer is stacked on the adhesion layer. The bond pad layer includes at least two first metal layers, at least two second metal layers and an outermost gold layer sequentially and alternately stacked. The first metal layers are selected from the group consisting Al and an Al alloy, and the second metal layers are selected from the group consisting of Ti, Ni, Cr, Pt, Pd, TiN, TiW, W, Rh and Cu. Thus, the main structure of the bond pad layer is a stacked structure of the first metal layers and the second metal layers. The first metal layers may be selected from a low-cost material, and the second metal layers improve issues of inadequate hardness and electromigration of the first metal layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.