Methods of forming curved image sensors
US9998643B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2015 |
| Grant date | Jun 12, 2018 |
| Priority date | — |
| Expiry date | Apr 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/804
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming curved image sensors may include applying positive pressure to the face of an image sensor, forcing the image sensor to adhere the curved surface of a substrate. The pressure may be applied to the face of the image sensor in a variety of ways, including using pneumatic pressure, hydraulic pressure, or pressure from an elastic or inelastic solid. Processing may occur on either a single image sensor die or an image sensor wafer. When an image sensor wafer is processed, a substrate may be used that has a number of cavities defined by respective curved surfaces with each cavity corresponding to a respective image sensor. When pressure is applied to the image sensor, the image sensor may deform until the curvature of the image sensor matches the curvature of the curved surface of the underlying substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.