Patent · US Active

Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals

US9998812B2 · kind B2 · utility

7Cited by

9References

12Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Klaus Elian · Alteglofsheim, DE
Horst Theuss · Wenzenbach, DE
Thomas Mueller · Lappersdorf, DE

Key dates

Filing date	Feb 15, 2016
Grant date	Jun 12, 2018
Priority date	—
Expiry date	Feb 15, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH04R2499/11
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.