Heat insulating cylinder for thermal treatment of semiconductor wafers
USD326273S · kind S · design
5Cited by
8References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 1989 |
| Grant date | May 19, 1992 |
| Priority date | — |
| Expiry date | May 19, 2006 |
Classification
- Technology area (CPC —)General
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.