Sealing material ring for a semiconductor manufacturing apparatus
USD862404S1 · kind S1 · design
30Cited by
14References
1Claims
0Family size
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Key dates
| Filing date | Apr 19, 2017 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Oct 8, 2034 |
Classification
- Technology area (CPC —)General
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.