Multilayer printed wiring board
USRE35064E · kind E · reissue
Assignee
Inventor
Key dates
| Filing date | May 12, 1993 |
| Grant date | Oct 17, 1995 |
| Priority date | — |
| Expiry date | May 12, 2013 |
Classification
- Technology area (CPC —)General
Abstract
A multilayer printed wiring board is presented for surface mounting or through hole technology, which includes one or more layers of a high capacitance flexible dielectric sheet material. The dielectric sheet is comprised of a monolayer of multilayer or single layer high dielectric constant (e.g. ceramic) chips or pellets of relatively small area and thickness which are arranged in a planar array. These high dielectric constant chips are spaced apart by a small distance. The spaces between the chips are then filled with a flexible polymer/adhesive to define a cohesive sheet with the polymer binding the array of high dielectric (e.g. ceramic) chips together. Next, the opposite planar surfaces of the array (including the polymer) are electroless plated or electroded by vacuum metal deposition, or sputtering, to define opposed metallized surfaces. The board of the present invention alleviates the need for decoupling capacitors, thus resulting in significant, space savings on the board surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.