Patent · US Expired

Device for interconnecting integrated circuit packages to circuit boards

USRE35733E · kind E · reissue

69Cited by
23References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 9, 1994
Grant dateFeb 17, 1998
Priority date
Expiry dateDec 9, 2014

Classification

  • Technology area (CPC —)General

Abstract

A novel and improved device for interconnecting an integrated circuit package to a circuit board is presented. In accordance with the present invention an integrated circuit package having an central area devoid of surface contacts is positioned over a resilient or compressible connector system. The compressible connector includes an opening about its center which corresponds to the central area on the integrated circuit package. A component is mounted on the circuit board within the opening of the compressible connector between the integrated circuit package and the circuit board.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.