Semiconductor package for a semiconductor chip having centrally located bottom bond pads
USRE37413E · kind E · reissue
Assignee
Inventor
Key dates
| Filing date | Sep 14, 1998 |
| Grant date | Oct 16, 2001 |
| Priority date | — |
| Expiry date | Sep 14, 2018 |
Classification
- Technology area (CPC —)General
Abstract
A semiconductor package having outer leads which are not protruded from the package but only exposed to outside. The semiconductor package comprises a semiconductor chip which is formed with a plurality of bond pads at a central portion of its bottom surface, a lead frame including leads connected to bond pads for input/output of the bond pads respectively and bus bars connected to power supplying pads of the bond pads, insulation adhesives for attaching inner leads of the leads and inner leads of the bus bars to a bottom surface of the semiconductor chip formed with the bond pads, metal wires for electrically connecting the inner leads of the leads and the inner leads of the bus bars to the bond pads respectively, and a molding compound enveloping the semiconductor chip assembly with outer leads of the lead frame exposed to outside. The adhesive tapes are removed after a molding procedure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.