Multi-temperature processing
USRE40264E1 · kind E1 · reissue
Inventor
Key dates
| Filing date | May 14, 2003 |
| Grant date | Apr 29, 2008 |
| Priority date | — |
| Expiry date | May 14, 2023 |
Classification
- Technology area (CPC —)General
Abstract
The present invention provides a technique, including a method and apparatus, for etching a substrate in the manufacture of a device. The apparatus includes a chamber and a substrate holder disposed in the chamber. The substrate holder has a selected thermal mass to facilitate changing the temperature of the substrate to be etched during etching processes. That is, the selected thermal mass of the substrate holder allows for a change from a first temperature to a second temperature within a characteristic time period to process a film. The present technique can, for example, provide different processing temperatures during an etching process or the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.