Process for assembling an integrated circuit package having a substrate vent hole
USRE44629E1 · kind E1 · reissue
2Cited by
14References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2004 |
| Grant date | Dec 10, 2013 |
| Priority date | — |
| Expiry date | Nov 30, 2024 |
Classification
- Technology area (CPC —)General
Abstract
The present invention involves a method of providing an integrated circuit package having a substrate with a vent opening. The integrated circuit package includes a substrate having an opening and an integrated circuit mounted to the substrate. An underfill material is dispensed between the substrate and the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.