Adhesive compositions for bonding and filling large assemblies
USRE46269E1 · kind E1 · reissue
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47References
32Claims
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Key dates
| Filing date | Sep 12, 2012 |
| Grant date | Jan 10, 2017 |
| Priority date | — |
| Expiry date | Sep 12, 2032 |
Classification
- Technology area (CPC —)General
Abstract
Adhesive composition for bonding and filling large assemblies, including a mixture of about 5 percent to about 75 percent by weight of a thermoplastic polymer, about 0.5 percent to about 35 percent by weight of a polyester resin or vinyl ester resin, and about 20 percent to about 80 percent by weight of an alkyl acrylate or methacrylate monomer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.