Method for the rapid processing of polymer layers in support of imidization processes and fan out wafer level packaging including efficient drying of precursor layers
USRE49802E1 · kind E1 · reissue
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Key dates
| Filing date | Mar 31, 2021 |
| Grant date | Jan 16, 2024 |
| Priority date | — |
| Expiry date | Mar 31, 2041 |
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- Technology area (CPC —)General
Abstract
A process for the drying, and subsequent imidization, of polyimide precursors which minimizes or eliminates voids and which minimizes or eliminates discoloration. The process uses a sequential set of descending pressure operations that allow for time efficient processing of wafers. The set of descending pressure operations are interspersed with evacuation processes using heated gasses, which combine heating and byproduct evacuation. The process results in layers with reduced or eliminated voiding, discoloration, and solvent retention.
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