Patent assignee · US · COMPANY

Adept Technology, Inc.

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24Patents
10Active
24Granted
44Portfolio score

Filing activity: Jan 24, 1985 → Jul 1, 2014 · 8 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US7313464B1 Bin-picking system for randomly positioned objects Physics 187 Active
US4876728A Vision system for distinguishing touching parts Physics 140 Expired
US4835730A Database driven robot programming system and method Emerging Cross-Sectional Technologies 78 Expired
USD722631S1 Mobile robotic platform General 76 Active
US6988008B2 Smart camera Physics 58 Expired
US4702668A Direct drive robotic system Emerging Cross-Sectional Technologies 48 Expired
US4794286A Variable reluctance stepper motor Electricity 45 Expired
US6056108A Impulse-based, flexible parts feeder Physics 44 Expired
US5687831A Flexible parts feeder Electricity 43 Expired
US8688275B1 Positive and negative obstacle avoidance system and method for a mobile robot Emerging Cross-Sectional Technologies 35 Active
US8200423B2 Mobile autonomous updating of GIS maps Physics 32 Active
US5314293A Direct drive robotic system Emerging Cross-Sectional Technologies 27 Expired
USD736117S1 Mobile robotic platform General 21 Active
US8560121B2 Vacuum gripping apparatus Performing Operations; Transporting 19 Active
USD722632S1 Mobile robotic platform General 17 Active
US4746843A Motor control circuit and drive amplifier for a permanent magnet DC torque motor Electricity 16 Expired
US4625158A Motor control circuit for variable reluctance motor Physics 14 Expired
US8290624B2 Uniform lighting and gripper positioning system for robotic picking operations Performing Operations; Transporting 12 Active
US7174224B2 Smart camera Physics 11 Expired
USD717208S1 Mobile robotic platform with surface pattern General 9 Active
USD722281S1 Mobile robotic platform General 8 Active
US6985780B2 Smart camera Physics 6 Expired
US4795306A Force sensor Performing Operations; Transporting 5 Expired
US6530734B2 Methods and apparatus for positive wafer process status identification during semiconductor wafer processing Emerging Cross-Sectional Technologies 2 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.