Cubic Memory, Inc.
16Patents
0Active
16Granted
31Portfolio score
Filing activity: Jun 23, 1994 → Mar 22, 1999
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5675180A | Vertical interconnect process for silicon segments | Emerging Cross-Sectional Technologies | 135 | Expired |
| US5891761A | Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform | Emerging Cross-Sectional Technologies | 83 | Expired |
| US6271598A | Conductive epoxy flip-chip on chip | Electricity | 71 | Expired |
| US5661087A | Vertical interconnect process for silicon segments | Emerging Cross-Sectional Technologies | 71 | Expired |
| US6098278A | Method for forming conductive epoxy flip-chip on chip | Emerging Cross-Sectional Technologies | 57 | Expired |
| US6080596A | Method for forming vertical interconnect process for silicon segments with dielectric isolation | Emerging Cross-Sectional Technologies | 50 | Expired |
| US5657206A | Conductive epoxy flip-chip package and method | Emerging Cross-Sectional Technologies | 49 | Expired |
| US5698895A | Silicon segment programming method and apparatus | Emerging Cross-Sectional Technologies | 49 | Expired |
| US6255726A | Vertical interconnect process for silicon segments with dielectric isolation | Emerging Cross-Sectional Technologies | 46 | Expired |
| US6134118A | Conductive epoxy flip-chip package and method | Emerging Cross-Sectional Technologies | 44 | Expired |
| US5837566A | Vertical interconnect process for silicon segments | Emerging Cross-Sectional Technologies | 36 | Expired |
| US6177296A | Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6124633A | Vertical interconnect process for silicon segments with thermally conductive epoxy preform | Emerging Cross-Sectional Technologies | 29 | Expired |
| US5936302A | Speaker diaphragm | Emerging Cross-Sectional Technologies | 18 | Expired |
| US5994170A | Silicon segment programming method | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6188126A | Vertical interconnect process for silicon segments | Emerging Cross-Sectional Technologies | 8 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.