Conductive epoxy flip-chip on chip
US6271598A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 1997 |
| Grant date | Aug 7, 2001 |
| Priority date | — |
| Expiry date | Aug 22, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip chip on chip assembly including a first flip chip; a second flip chip directly connected to the top of the first flip chip; and electrically conductive epoxy means disposed between the second flip chip and the top of the first flip chip to form an electrical connection between the first flip chip and the second flip chip. In another preferred embodiment, the present invention provides a flip chip assembly including a plurality of semiconductor chips where the plurality of chips are vertically interconnected on top of one another to form an electrically interconnected stack of chips; a flip chip directly connected to the top chip of the stack of chips; and electrically conductive epoxy means disposed between said flip chip and said top chip to form an electrical connection between the flip chip and the top chip. In still another preferred embodiment, the present invention provides a flip chip assembly including a semiconductor wafer having a plurality of first flip-chips formed thereon; a plurality of second flip chips, each one of the second flip chips directly connected to a respective one of the plurality of first flip-chips; and electrically conductive epoxy means dispose…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.