Express Packaging Systems, Inc.
3Patents
0Active
3Granted
31Portfolio score
Filing activity: Feb 11, 1997 → Feb 11, 1999
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6075710A | Low-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chips | Emerging Cross-Sectional Technologies | 159 | Expired |
| US6057601A | Heat spreader with a placement recess and bottom saw-teeth for connection to ground planes on a thin two-sided single-core BGA substrate | Electricity | 140 | Expired |
| US5825084A | Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices | Electricity | 75 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.