GEM Services, Inc.
48Patents
8Active
48Granted
34Portfolio score
Filing activity: May 15, 2001 → Oct 31, 2011 · 7 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD465207S1 | Leadframe matrix for a surface mount package | General | 40 | Expired |
| US7057273B2 | Surface mount package | Emerging Cross-Sectional Technologies | 28 | Expired |
| US8358017B2 | Semiconductor package featuring flip-chip die sandwiched between metal layers | Electricity | 24 | Active |
| US7122406B1 | Semiconductor device package diepad having features formed by electroplating | Electricity | 15 | Expired |
| USD471165S1 | Surface mount package | General | 15 | Expired |
| US7215012B2 | Space-efficient package for laterally conducting device | Electricity | 14 | Expired |
| USD588080S1 | 2021-8J matrix leadframe | General | 14 | Expired |
| US7382044B1 | Semiconductor device package diepad having features formed by electroplating | Electricity | 12 | Expired |
| USD484859S1 | Portion of a matrix for surface mount package leadframe | General | 9 | Expired |
| USD484104S1 | Portion of a matrix for surface mount package leadframe | General | 9 | Expired |
| USD483336S1 | Portion of a matrix for surface mount package leadframe | General | 9 | Expired |
| USD484858S1 | Portion of a matrix for surface mount package leadframe | General | 9 | Expired |
| US7838339B2 | Semiconductor device package having features formed by stamping | Emerging Cross-Sectional Technologies | 9 | Active |
| USD488136S1 | Portion of a matrix for surface mount package leadframe | General | 8 | Expired |
| USD492266S1 | Portion of a matrix for surface mount package leadframe | General | 8 | Expired |
| USD487431S1 | Portion of a matrix for surface mount package leadframe | General | 8 | Expired |
| USD487432S1 | Portion of a matrix for surface mount package leadframe | General | 8 | Expired |
| USD485244S1 | Portion of a matrix for surface mount package leadframe | General | 8 | Expired |
| USD588557S1 | 4040-28J matrix leadframe | General | 8 | Expired |
| USD484103S1 | Portion of a matrix for surface mount package leadframe | General | 7 | Expired |
| USD485808S1 | Portion of a matrix for surface mount package leadframe | General | 7 | Expired |
| USD483337S1 | Portion of a matrix for surface mount package leadframe | General | 7 | Expired |
| USD505121S1 | Portion of a matrix for surface mount package leadframe | General | 6 | Expired |
| USD461172S1 | Surface mount package | General | 6 | Expired |
| USD467231S1 | Surface mount package | General | 6 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.