Monitoring method for chemical mechanical polishing and chemical mechanical polishing device
US12151335B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2024 |
| Grant date | Nov 26, 2024 |
| Priority date | — |
| Expiry date | Jun 28, 2044 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A monitoring method and a device for chemical mechanical polishing are provided. The method includes: loading a to-be-polished wafer with a carrier, attaching the wafer to a polishing pad on a polishing platen, and supplying slurry between the polishing pad and the wafer with a slurry supply apparatus; conditioning the polishing pad with a conditioner, and obtaining strain data of the conditioner, wherein the conditioner includes a drive arm and a conditioning head, the conditioning head conditions the polishing pad with the support of the drive arm, the drive arm undergoes a strain in response to a force applied by the the conditioning head, and the strain data is used to indicate a strain value of the drive arm; determining a conditioning deviation based on the strain data, and determining a wear state of the polishing pad based on the conditioning deviation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.