HyperNex, Inc.
6Patents
0Active
6Granted
27Portfolio score
Filing activity: Sep 1, 1998 → Dec 23, 2003
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6301330A | Apparatus and method for texture analysis on semiconductor wafers | Electricity | 20 | Expired |
| US6882739B2 | Method and apparatus for rapid grain size analysis of polycrystalline materials | Physics | 19 | Expired |
| US6678347B1 | Method and apparatus for quantitative phase analysis of textured polycrystalline materials | Physics | 7 | Expired |
| US6058160A | Photo-sensor fiber-optic stress analysis system | Physics | 6 | Expired |
| US6792075B2 | Method and apparatus for thin film thickness mapping | Physics | 2 | Expired |
| US6909772B2 | Method and apparatus for thin film thickness mapping | Physics | 1 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.