Intercon Tools, Inc.
4Patents
0Active
4Granted
24Portfolio score
Filing activity: Sep 18, 1998 → Nov 17, 2000
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6165232A | Method and apparatus for securely holding a substrate during dicing | Electricity | 22 | Expired |
| US6187654A | Techniques for maintaining alignment of cut dies during substrate dicing | Electricity | 17 | Expired |
| US6325059A | Techniques for dicing substrates during integrated circuit fabrication | Electricity | 11 | Expired |
| US6448156B1 | Techniques for maintaining alignment of cut dies during substrate dicing | Electricity | 4 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.