Jun Hee Jeong
2Patents
2Active
2Granted
43Portfolio score
Filing activity: Aug 1, 2016 → Aug 1, 2016
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10474192B2 | Wearable smart device having flexible semiconductor package mounted on a band | Electricity | 19 | Active |
| US10522522B2 | Package substrate comprising side pads on edge, chip stack, semiconductor package, and memory module comprising same | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.