Wearable smart device having flexible semiconductor package mounted on a band
US10474192B2 · kind B2 · utility
19Cited by
1References
10Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 1, 2016 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Aug 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04W4/80
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A wearable smart device of the present invention comprises: a main body on which a basic module is mounted; a band on which at least one auxiliary module is mounted, which is selectively attached and detached to the main body made of a polymer material or a rubber material to be bent; a connector electrically connecting the main body and the band; and a coupler physically connecting the main body and the band. According to a configuration of the present invention, the present invention is possible in realizing a high-capacity and high-performance smart device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.