LAN TECHNICAL SERVICE CO., LTD.
8Patents
5Active
8Granted
40Portfolio score
Filing activity: May 24, 2000 → Jul 16, 2015
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9601350B2 | Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly | Electricity | 6 | Active |
| US10166749B2 | Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly | Emerging Cross-Sectional Technologies | 2 | Active |
| US6801269B2 | Method and device for connecting display panel substrates | Physics | 2 | Expired |
| US7110080B2 | Device for connecting display panel substrates comprising a spacer having a plurality of spacer elements or a rotatable head section for controlling cell gap | Physics | 2 | Expired |
| US9331305B2 | Electronic element sealing method and bonded substrate | Electricity | 1 | Active |
| US6445436B1 | Device for sealing a liquid crystal injection hole of a liquid crystal cell | Physics | 1 | Expired |
| US10043975B2 | Thin substrate, method for manufacturing same, and method for transporting substrate | Emerging Cross-Sectional Technologies | 0 | Active |
| US9962908B2 | Method for bonding polymer film and polymer film, method for bonding polymer film and inorganic material substrate, polymer film laminate, and laminate of polymer film and inorganic material substrate | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.