Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly
US10166749B2 · kind B2 · utility
2Cited by
3References
13Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 30, 2012 |
| Grant date | Jan 1, 2019 |
| Priority date | — |
| Expiry date | Aug 9, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
[Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.