Microsubstrates Corporation
5Patents
0Active
5Granted
29Portfolio score
Filing activity: Nov 3, 1988 → Jun 16, 1999
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4942076A | Ceramic substrate with metal filled via holes for hybrid microcircuits and method of making the same | Emerging Cross-Sectional Technologies | 72 | Expired |
| US5089881A | Fine-pitch chip carrier | Electricity | 66 | Expired |
| US6215377A | Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format | Electricity | 46 | Expired |
| US5707575A | Method for filling vias in ceramic substrates with composite metallic paste | Electricity | 27 | Expired |
| US6426686B1 | Microwave circuit packages having a reduced number of vias in the substrate | Electricity | 22 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.