Microwave circuit packages having a reduced number of vias in the substrate
US6426686B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1999 |
| Grant date | Jul 30, 2002 |
| Priority date | — |
| Expiry date | Jun 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3436
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit package for a microwave signal comprises a substrate defining a MMIC surface of the substrate and an opposing non-MMIC surface of the substrate. The substrate is devoid of signal carrying vias. A waveguide is disposed on the MMIC surface of the substrate. A MMIC is disposed on the MMIC surface of the substrate, and the MMIC is in electrical communication with the waveguide. An I/O port is in electrical communication with the waveguide wherein a transmission path for the signal is provided from the I/O port, through the waveguide and to the MMIC. In an alternative exemplary embodiment of the invention, the I/O port of the circuit package is electrically connectable to a PC board. The MMIC surface of the substrate faces the PC board when the I/O port is electrically connected to the PC board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.