Method for filling vias in ceramic substrates with composite metallic paste
US5707575A · kind A · utility
27Cited by
2References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 1994 |
| Grant date | Jan 13, 1998 |
| Priority date | — |
| Expiry date | Jul 28, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0338
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparati for improved filling of via holes wherein compressive force is used to columnate conductive material due to a pseudoplastic thixotropic rheology of the material. Columnating of the material provides for easier and more accurate filling of via holes. Both automated roller apparati and manual methods are provided. The method further includes methods and apparati of removing excess conductive material from substrates after filling the via holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.