NSCRYPT, INC.
6Patents
6Active
6Granted
46Portfolio score
Filing activity: Jul 13, 2006 → Jan 18, 2019 · 1 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7972650B1 | Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections | Electricity | 25 | Active |
| US10059056B2 | Micro-dispensing multi-layered 3D objects with curing steps | Emerging Cross-Sectional Technologies | 2 | Active |
| US11230054B1 | Active valve for mixing and dispensing control | Performing Operations; Transporting | 2 | Active |
| US8790742B2 | Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections | Electricity | 1 | Active |
| US12052828B2 | Dispensing patterns including lines and dots at high speeds | Electricity | 0 | Active |
| US10500830B2 | Method and apparatus for 3D fabrication | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.