Dispensing patterns including lines and dots at high speeds
US12052828B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2009 |
| Grant date | Jul 30, 2024 |
| Priority date | — |
| Expiry date | Jan 5, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0126
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for depositing a material on a substrate includes providing an apparatus with at least one material dispenser. The method further includes positioning the pen tip at a predetermined writing gap where the predetermined writing gap is a distance of more than 75 micrometers above the substrate. The method also provides for controlling velocity of the flow of material through the outlet and dispense speed based on dispensed line height and dispensed line width parameters. An apparatus for depositing a material on a substrate is also provided which may have one or more mechanical vibrators, a pen tip with a hydrophobic surface, or multiple nozzles and pen tips on a single pump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.